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Multilayer Ceramic Capacitor - High Frequency -
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Multilayer Ceramic Capacitor - High Frequency
INTRODUCTION
MLCC for high frequency application is made of many layers of Class I(C0G, etc) ceramic and Cu inner electrodes like sandwich. Class I(C0G, etc) ceramic has a small TCC(Temperature Coefficient of Capacitance), a better frequency performance and a low ESR(Equivalent Series Resistance) value. Therefore, it is used in RF applications such as cellular phone, tuner, and so on.
FEATURE AND APPLICATION
Feature - Miniature Size - Wide Capacitance and Voltage Range - Highly Reliable Performance - Tape & Reel for Surface Mount Assembly - Low ESR - High Q at High Frequencies - Stable Temperature Dependence of Capacitance Application - High frequency module and high power circuit
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Multilayer Ceramic Capacitor - High Frequency
STRUCTURE
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Multilayer Ceramic Capacitor - High Frequency
APPEARANCE AND DIMENSION
L
T
W BW
CODE 03 05
EIA CODE L 0201 0402 0.6 0.03 1.0 0.05
DIMENSION ( mm ) W 0.3 0.03 0.5 0.05 T (MAX) 0.3 0.03 0.5 0.05 BW 0.15 0.05 0.2+0.15/-0.1
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Multilayer Ceramic Capacitor - High Frequency
PREVIOUS PART NUMBERING CL 1 10 2 C 3 101 4 J 5 B 6 G 7 C 8
1 SAMSUNG Multilayer Ceramic Capacitor 2 Type(Size) 3 Capacitance Temperature Characteristics("C" 4 Nominal Capacitance 5 Capacitance Tolerance 6 Rated Voltage 7 Code "G" : Cu-Inner electrode 8 Packaging Type
only)
3 TEMPERATURE CHARACTERISTICS CLASS (Temperature Compensating type) Symbol C EIA Code C0G(CH) Temperature Coefficient(PPM/) 0 30
Temperature
Characteristics C
Operation Temperature Range -55 ~ +125
Temperature Characteristics Temperature below 2.0pF 2.2 ~ 3.9pF above 4.0pF Characteristics C P R S T U C0G C0G P2J R2J S2J T2J U2J C0G P2H R2H S2H T2H U2J K : 250 PPM/ above 10pF C0G P2H R2H S2H T2H U2J J : 120 PPM/ H : 60 PPM/ G : 30 PPM/
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Multilayer Ceramic Capacitor - High Frequency
4 NOMINAL CAPACITANCE The nominal capacitance value is expressed in pico-farad(pF) and identified by three-digits. The first two digits represent significant figures and the last digit specifies the number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal point. example) 100 : 10 x 10o =
2
10pF 2pF
102 : 10 x 10 = 1000pF 020 : 2 x 10o = 1R5 : 1.5pF
5 CAPACITANCE TOLERANCE Temperature Characteristics Symbol B C0G(NPO) or T.C Series C D F J Capacitance tolerance 0.1pF 0.25pF 0.50pF 1% 5% <10pF E-24 step E-24 step E-12 step Capacitance range 0.5~2.0pF 2.0~5.0pF capacitance step 0.1pF E-24 step
10pF
Please consult us for special tolerances.
6 RATED VOLTAGE Symbol A B Rated Voltage(Vdc) 25V 50V
7 Type of Inner electrode Symbol G Description of the Code Copper inner electrode-standard thickness
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Multilayer Ceramic Capacitor - High Frequency
8 PACKAGING TYPE Symbol B P C D E Packaging Bulk Cassette Paper Tape, 7" Reel Paper Tape, 13" Reel Embossed Tape, 7" Reel Symbol F L O S Packaging Embossed Tape, 13" Reel Paper 13" Reel Paper 10" Reel Embossed Tape, 10" Reel
STANDARD CAPACITANCE STEP Series E- 3 E- 6 E-12 E-24 1.0 1.0 1.1 1.0 1.2 1.2 1.3 1.5 1.5 1.6 1.0 1.5 1.8 1.8 2.0 2.2 2.2 2.4 2.2 2.7 2.7 3.0 3.3 3.3 3.6 Capacitance step 2.2 3.3 3.9 3.9 4.3 4.7 4.7 5.1 4.7 5.6 5.6 6.2 6.8 6.8 7.5 4.7 6.8 8.2 8.2 9.1
Standard Capacitance is " Each step x10n "
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Multilayer Ceramic Capacitor - High Frequency
NEW PART NUMBERING CL 1 10 2 C 3 101 4 J 5 B 6 8 7 G 8 N 9 N 10 C 11
1 SAMSUNG Multilayer Ceramic Capacitor 2 Size(mm) 3 Capacitance Temperature Characteristic 4 Nominal Capacitance 5 Capacitance Tolerance 6 Rated Voltage 7 Thickness Option 8 Product & Plating Method 9 Samsung Control Code 10 Reserved For Future Use 11 Packaging Type
1 PRODUCT ABBREVIATION Symbol CL Product Abbreviation SAMSUNG Multilayer Ceramic Chip Capacitor
2 SIZE(mm) Symbol 03 05 Size(mm) Length 0.6 1.0 Width 0.3 0.5
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Multilayer Ceramic Capacitor - High Frequency
3 TEMPERATURE CHARACTERISTICS CLASS (Temperature Compensating type) Symbol C EIA Code C0G(CH) Temperature Coefficient(PPM/) 0 30
Temperature
Characteristics C
Operation Temperature Range -55 ~ +125
Temperature Characteristics Temperature below 2.0pF 2.2 ~ 3.9pF above 4.0pF Characteristics C P R S T U C0G C0G P2J R2J S2J T2J U2J C0G P2H R2H S2H T2H U2J K : 250 PPM/ above 10pF C0G P2H R2H S2H T2H U2J J : 120 PPM/ H : 60 PPM/ G : 30 PPM/
4 NOMINAL CAPACITANCE Nominal capacitance is identified by 3 digits. The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. 'R' identifies a decimal point. Example Symbol 1R5 103 104 Nominal Capacitance 1.5pF 10,000pF, 10nF, 0.01F 100,000pF, 100nF, 0.1F
5 CAPACITANCE TOLERANCE Symbol B C D F J Tolerance 0.1pF 0.25pF 0.5pF 1% 5% More than 10pF Less than 10pF (Including 10pF) Nominal Capacitance
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Multilayer Ceramic Capacitor - High Frequency
6 RATED VOLTAGE Symbol A Rated Voltage 25V Symbol B Rated Voltage 50V
7 THICKNESS OPTION Type 0603 1005 Symbol 3 5 Thickness(T) 0.30 0.50 Spec 0.03 0.05
8 PRODUCT & PLATING METHOD Symbol A N G Electrode Pd Ni Cu Termination Ag Cu Cu Plating Type Sn_100% Sn_100% Sn_100%
9 SAMSUNG CONTROL CODE Symbol A B C L Description of the code Array (2-element) Array (4-element) High - Q LICC Symbol N P W Description of the code Normal Automotive 3 Terminal EMI Filter
10 RESERVED FOR FUTURE USE
Symbol N
Description of the code Reserved for future use
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Multilayer Ceramic Capacitor - High Frequency
11 PACKAGING TYPE
Symbol B P C D E
Packaging Type Bulk Bulk Case Paper 7" Paper 13" (10,000EA) Embossing 7"
Symbol F L O S
Packaging Type Embossing 13" (10,000EA) Paper 13" (15,000EA) Paper 10" Embossing 10"
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Multilayer Ceramic Capacitor - High Frequency
CAPACITANCE vs CHIP THICKNESS STANDARD
Description L Dimension(mm) W T MAX CAPACITANCE(pF) 25V C 50V 10 0603 type (0201) 0.60.03 0.30.03 0.30.03 20 1005 type (0402) 1.00.05 0.50.05 0.50.05 -
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Multilayer Ceramic Capacitor - High Frequency
PACKAGING
CARDBOARD PAPER TAPE
Feeding round holes Perforated square holes for inserting a chip
D E
A
FW
B
t
P0
P2
P1 unit : mm
Symbol Type D i m e n s i o n 03
W
F
E
P1
P2
P0
D
t
A
B
0.37 0.03 8.0 0.3 3.5 0.05 1.75 0.1 2.0 0.05 2.0 0.05 4.0 0.1 1.5 +0.1/-0 0.6 0.05
0.38 0.03 0.65 +0.05 -0.10
0.68 0.03 1.15 +0.05 -0.10
05
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Multilayer Ceramic Capacitor - High Frequency
TAPING SIZE
Empty Section 45 Pitch Packed Part Empty Section 50 Pitch Loading Section 35 Pitch
END
START
unit : pcs Symbol 7" Reel 13" Reel Cardboard Paper Tape 10000 10000
REEL DIMENSION
E C
R
B D
W A
t
unit : mm Symbol 7" Reel 13" Reel A 1782.0 3302.0 B min.50 130.5 min.70 210.8 2.00.5 101.5 0.80.2 1.0 C D E W t R
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Multilayer Ceramic Capacitor - High Frequency
BULK CASE PACKAGING
- Bulk case packaging can reduce the stock space and transportation costs. - The bulk feeding system can increase the productivity. - It can eliminate the components loss.
A C D E
B
T
F
W
G H
L
I
Symbol Dimension Symbol Dimension
A 6.80.1 F 31.5+0.2/-0
B 8.80.1 W 36+0/-0.2
T 120.1 G 190.35
C 1.5+0.1/-0 H 70.35
D 2+0/-0.1 L 1100.7
E 4.70.1 I 50.35
QUANTITY
Size Quantity * N/A : Not adapted 03(0201) N/A 05(0402) 50,000
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Multilayer Ceramic Capacitor - High Frequency
CHARACTERISTIC MAP
CAPACITANCE RANGE
CLASS
Temperature Characteristics
Capacitance Range () Size
03 (0201)
Voltage
0.5
10
100
1000
10000
100000
1000000
10000000
100000000
25V 50V 10
20
C(COG)
05 (0402)
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Multilayer Ceramic Capacitor - High Frequency
RELIABILITY TEST DATA
NO ITEM PERFORMANCE
NO ABNORMAL EXTERIOR APPEARANCE.
TEST CONDITION
1
APPEARANCE
THROUGH MICROSCOPE(x10)
10,000 OR 500* PRODUCT
2
INSULATION RESISTANCE
WHICHEVER IS SMALLER. (RATED VOLTAGE IS BELOW 16V : 10,000 OR 100*)
RATED VOLTAGE SHALL BE APPLIED. MEASUREMENT TIME IS 60 ~ 120sec RATED VOLTAGE TIME 60 SEC.
3
WITHSTANDING VOLTAGE
NO DIELECTRIC BREAKDOWN OR MECHANICAL BREAKDOWN.
CLASS: 300% OF THE RATED VOLTAGE FOR 1~5SEC,
CAPACITANCE
FREQUENCY
VOLTAGE
4
CAPACITANCE
CLASS
WITHIN THE SPECIFIED TOLERANCE
1,000 AND BELOW MORE THAN 1,000
110% 0.5 ~ 5 Vrms 110%
CAPACITANCE OVER 30 : Q 1,000 LESS THAN 30: Q 400 +20C ( C : CAPACITANCE )
FREQUENCY
VOLTAGE
5
Q
CLASS
1,000 AND BELOW MORE THAN 1,000
110% 0.5 ~ 5 Vrms 110%
A 500g.f PRESSURE SHALL BE NO INDICATION OF PEELING APPLIED FOR 101 SECOND.
6
ADHESIVE STRENGTH OF TERMINATION
OCCUR ON THE TERMINAL ELECTRODE.
500g.f
2pF < C 5pF : BELOW 200m
TEST EQUIPMENT : E4991B CONDITION: FREQUENCY 1GHz, Osc 100m AT ROOM TEMPERATURE
7
ESR
5pF < C 10pF : BELOW 150m 10pF < C 33pF : BELOW 100m
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Multilayer Ceramic Capacitor - High Frequency
NO
ITEM
APPEARANCE
PERFORMANCE
NO MECHANICAL DAMAGE SHALL OCCUR. CHANGE OF CAPACITANCE 50
TEST CONDITION
BENDING SHALL BE APPLIED TO THE LIMIT(1mm) WITH 0.3mm/SEC. 20 R=340
CHARACTER
8
BENDING STRENGTH
CAPACITANCE
WITHIN 5% OR CLASS I 0.5pF WHICHEVER IS LARGER
451 451
BENDING LIMIT
MORE THAN 95% OF THE TERMINAL SURFACE IS TO BE SOLDERED NEWLY, SO METAL PART(A) DOES NOT COME OUT OR DISSOLVE. SOLDER TEMPERATURE : 2305 DIP TIME SOLDER FLUX *PB-FREE : 31 Sec : H63A : RMA TYPE
9
SOLDERABILITY
SOLDER TEMPERATURE : 2605 SOLDER : Sn96.5-3Ag-0.5Cu Flux : RMA TYPE IN PB--FREE PART, MORE THAN 95% OF THE TERMINAL SURFACE IS TO BE SOLDERED NEWLY NO MECHANICAL DAMAGE SHALL OCCUR. CHARACTERISTIC CAP. CHANGE DIP TIME : 30.1Sec * PRE-HEATING : AT 80~120 FOR 10~30SEC. DIP : SOLDER TEMPERATURE OF 2705 DIP TIME : 101 SEC. EACH TERMINATION SHALL BE FULLY IMMERSED AND PREHEATED AS WITHIN 2.5% OR FOLLOWING:
APPEARANCE
CAPACITANCE CLASS RESISTANCE 10 TO SOLDERING HEAT Q CLASS INSULATION RESISTANCE WITHSTANDING VOLTAGE
0.25 WHICHEVER IS LARGER STEP 1 2 30 AND OVER : Q 1000 LESS THAN 30 : Q 400+20xC MEASURE AT ROOM TEMP. AFTER TO SATISFY THE SPECIFIED INITIAL VALUE. TO SATISFY THE SPECIFIED INITIAL VALUE. COOLING FOR CLASS : 24 2 HOURS TEMP.() 80~100 150~180 TIME (SEC.) 60 60
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Multilayer Ceramic Capacitor - High Frequency
NO ITEM
APPEARANCE
PERFORMANCE
NO MECHANICAL DAMAGE SHALL OCCUR. CHARACTERISTI CAP. CHANGE WITHIN 2.5% OR CLASS 0.25 WHICHEVER IS LARGER CLASS B F WITHIN 5% WITHIN 20%
TEST
CONDITION
THE CAPACITOR SHALL BE SUBJECTED TO A HARMONIC MOTION HAVING A TOTAL AMPLITUDE OF 1.5mm.
CAPACITANCE
THE ENTIRE FREQUENCY RANGE, FROM 10 TO 55Hz AND RETURN TO 10Hz, SHALL BE TRAVERSED IN 1 MINUTE.
11
VIBRATION TEST Q CLASS
30 AND OVER : Q 1000 LESS THAN 30 : Q 400+20xC THIS CYCLE SHALL BE PERFORMED 2 HOURS IN EACH THERE
INSULATION RESISTANCE APPEARANCE
TO SATISFY THE SPECIFIED INITIAL VALUE. NO MECHANICAL DAMAGE SHALL OCCUR. CHARACTERISTI C CAPACITANCE CHANGE WITHIN 5% OR CLASS 0.5 WHICHEVER IS LARGER
MUTUALLY PERPENDICULAR DIRECTION FOR TOTAL PERIOD OF 6 HOURS. TEMPERATURE : 402
RELATIVE HUMIDITY : 90~95 %RH TEST TIME : 500 +12/-0 Hr.
CAPACITANCE HUMIDITY
MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR CLASS : 242 Hr.
12
(STEADY STATE) Q CLASS
30 AND OVER : Q 350 10 ~30 : Q 275 + 2.5xC
LESS THAN 10pF : Q 200 + 10xC MINIMUM INSULATION RESISTANCE: 1,000 OR 50* PRODUCT WHICHEVER IS SMALLER.
APPLIED VOLTAGE : RATED VOLTAGE
INSULATION RESISTANCE
APPEARANCE
NO MECHANICAL DAMAGE SHALL OCCUR.
TEMPERATURE : 402 RELATIVE HUMIDITY:90~95%RH TEST TIME : 500 +12/-0 Hr.
CHARACTERISTI C CAPACITANCE CLASS
CAPACITANCE CHANGE WITHIN 7.5% OR 0.75 WHICHEVER IS LARGER
CURRENT APPLIED : 50 MAX.
CLASS SHOULD BE MEASURED INITIAL VALUE AFTER BE HEAT-TREATED FOR 1 HR IN 150+0/-10 AND BE LEFT FOR
13
MOISTURE RESISTANCE Q CLASS
30 AND OVER : Q 200 30 AND BELOW : Q 100 + 10/3xC
484HR AT ROOM TEMPERATURE. CLASS SHOULD BE MEASURED AFTER LEFT FOR 242 HRS IN ROOM
INSULATION RESISTANCE
MINIMUM INSULATION RESISTANCE: 500 OR 25* PRODUCT, WHICHEVER IS SMALLER.
TEMPERATURE AND HUMIDITY. CLASS SHOULD BE MEASURED LATTER VALUE AFTER BE HEAT-TREATED FOR 1 HR IN 150+0/-10 AND BE LEFT FOR 484HR AT ROOM TEMPERATURE.
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Multilayer Ceramic Capacitor - High Frequency
NO ITEM PERFORMANCE
NO MECHANICAL DAMAGE SHALL OCCUR. CHARACTERIS TIC
TEST CONDITION
APPLIED VOLTAGE : 200% OF RATED VOLTAGE TEST TIME : 1000 +48/-0 Hr. CURRENT APPLIED : 50 MAX.
APPEARANCE
CAP. CHANGE
Temp :125 3

CAPACITANCE HIGH CLASS
WITHIN 3% OR 0.3, WHICHEVER IS LARGER
CLASS SHOULD BE MEASURED INITIAL VALUE AFTER BE HEAT-TREATED FOR 1 HR IN 150+0/-10 AND BE LEFT FOR 484HR AT ROOM TEMPERATURE. CLASS SHOULD BE MEASURED AFTER LEFT FOR 242 HRS IN ROOM TEMPERATURE AND HUMIDITY. CLASS SHOULD BE MEASURED LATTER VALUE AFTER BE HEAT-TREATED FOR 1 HR IN 150+0/-10 AND BE LEFT FOR 484HR AT ROOM TEMPERATURE.
14
TEMPERATURE RESISTANCE
Q CLASS
30 AND OVER : Q 350 10 ~ 30 : Q 275 + 2.5xC LESS THAN 10 :Q 200 + 10xC MINIMUM INSULATION RESISTANCE: 1,000 OR 50* PRODUCT WHICHEVER IS SMALLER.
INSULATION RESISTANCE
CAPACITORS SHALL BE SUBJECTED APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR. TO FIVE CYCLES OF THE TEMPERATURE CYCLE AS FOLLOWING CHARACTERISTIC CAP. CHANGE WITHIN 2.5% CLASS OR 0.25 WHICHEVER IS LARGER 1 MIN. RATED TEMP. +0/-3 2 25 MAX. 3 RATED TEMP. +3/-0 4 INSULATION RESISTANCE TO SATISFY THE SPECIFIED INITIAL VALUE. MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR CLASS : 242 Hr. CLASS : 484 Hr. 25 2~3 30 2~3 30 STEP TEMP.() TIME (MIN)
CAPACITANCE
15
TEMPERATURE CYCLE Q CLASS
30 AND OVER : Q 1000 LESS THAN 30:Q 400 +20xC
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Multilayer Ceramic Capacitor - High Frequency
CHARACTERISTIC GRAPH
ELECTRICAL CHARACTERISTICS
CAPACITANCE - TEMPERATURE CHARACTERISTICS
10 20 5 0 C0G RH SH TH UJ
X7R
C %
0 -5 -10 -60
C %
-20 -40 -60 -80 -60 -20 0 20 40 80
Y5V
120
-20
0
20
60
100
140
Temperature()
Temperature()
CAPACITANCE - DC VOLTAGE CHARACTERISTICS CAPACITANCE CHANGE - AGING
40 20 0
C0G 50V X7R 50V 0 10
C0G X7R Y5V
C %
-20 -40 -60 -80 -100 0 5 10 15 20 25 30 DC V o l t a g e (V d c )
C %
-10 -20 -30
Y5V 50V
35
40
0
50 100
1000
10000
Time(Hr)
IMPEDANCE - FREQUENCY CHARACTERISTICS
1000
Impedance()
100
4pF
10
7pF 7.8pF
1 GHZ 1GHZ 2GHZ 3GHZ
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Multilayer Ceramic Capacitor - High Frequency
APPLICATION MANUAL
Storage Condition
Storage Environment The electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative humidity of less than 40 and 70%, respectively. Guaranteed storage period is within 6 months from the outgoing date of delivery. Corrosive Gases Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorin, acid or sulfide gases, MLCCs must be avoid from these gases. Temperature Fluctuations Since dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage, it is important to maintain the temperature-controlled environment.
Design of Land Pattern
When designing printed circuit boards, the shape and size of the lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently. Use the following illustrations as guidelines for proper land design. Recommendation of Land Shape and Size
Solder Resist Solder Resist
T W
Solder Land
b a
2/3W < b < W
2/3T < a < T
Adhesives
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions. Requirements for Adhesives They must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board. They must maintain their adhesive strength when exposed to soldering temperature. They should not spread or run when applied to the circuit board. They should harden quickly. They should not corrode the circuit board or chip material.
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Multilayer Ceramic Capacitor - High Frequency
They should be a good insulator. They should be non-toxic, and not produce harmful gases, nor be harmful when touched. Application Method It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor adhesion and overflow into the land, respectively. Adhesive hardening Characteristics To prevent oxidation of the terminations, the adhesive must harden at 160 or less, within 2 minutes or less.
Mounting
Mounting Head Pressure Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during mounting. Bending Stress When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the board. When the MLCCs are mounted onto the other side, it is important to support the board as shown in the illustration. If the circuit board is not supported, the crack occur to the ready-installed MLCCs by the bending stress. nozzle
force
support pin
Flux
Although the solderability increased by the highly-activated flux, increase of activity in flux may
also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended
that a mildly activated rosin flux(less than 0.2% chlorine) be used.
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Multilayer Ceramic Capacitor - High Frequency
Soldering
Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering, it is exposed to potentially mechanical stress caused by the sudden temperature change. The capacitor may also be subject to silver migration, and to contamination by the flux. Because of these factors, soldering technique is critical. Soldering Methods Method - Overall heating Reflow soldering - Local heating Flow soldering - Single wave - Double wave Classification - Infrared rays - Hot plate - VPS(vapor phase) - Air heater - Laser - Light beam -
* We recommend the reflow soldering method. Soldering Profile To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph.
300 250 200 150 100 50
preheating soldering cooling
300 250 200
preheating
soldering
cooling
T150 150 100 50
60~120sec
10~20sec
60~120sec
3~4sec
Reflow Soldering
Flow Soldering
Manual Soldering Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot
soldering iron tip comes into direct contact with the end terminations, and operator's carelessness
may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip.
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Multilayer Ceramic Capacitor - High Frequency
Amount of Solder
Too much Solder
Cracks tend to occur due to large stress
Weak holding force may Not enough Solder cause bad connections or detaching of the capacitor
Good
Cooling Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference(T) must be less than 100 6-6. Cleaning If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new. Notes for Separating Multiple, Shared PC Boards. A multi-PC board is separated into many individual circuit boards after soldering has been completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending of the circuit board.
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Multilayer Ceramic Capacitor - High Frequency
CROSS REFERENCE
P/N
COMPANY
COMPANY
MODEL(MLCC) 0201(0603) 0402(1005) 0603(1608) 0805(2012) SIZE (EIA/JIS) 1206(3216) 1210(3225) 1808(4520) 1812(4532) 2220(5750)
SAMSUNG
CL 03 05 10 21 31 32 42 43 55
AVX
0402 0603 0805 1206 1210 1808 1812 -
JOHANSON
R07 R14 R15 R18 S41 R29 S43 -
KEMET
C 0402 0603 0805 1206 1210 1808 1812 2220
KYOCERA
CM 03 05 105 21 316 32 42 43 55
MURATA
GRM 33 36 39 40 42-6 42-2 43-2 44-1
NOVACAP
0402 0603 0805 1206 1210 1808 1812 2221
PANASONIC
ECJ Z 0 1 2 3 4 -
ROHM
MCH 15 18 21 31 32 43 -
TAIYO - YUDEN
MK 063 105 107 212 316 325 432 550
TDK
C 0603 1005 1608 2012 3216 3225 4520 4532 5650
VITRAMON
VJ 0402 0603 0805 1206 1210 1808 1812 -
COG(NPO)
C
A
N
G
CG
COG/CH
N
C
A
C
COG/CH
A
P2H(N150) R2H(N220) S2H(N330) TEMPERATURE CHARACTERISTIC U2J(N750) S2L X7R Z5U T2H(N470)
P R S T U L B E
S 1 3 O Z Y C E
W Z
R(X) U
P R S T U SL X7R -
P2H R2H S2H T2H U2J SL X7R Z5U
B Z
P R S T U G B -
UJ SL C E
P R S T U SL BJ -
PH RH SH TH UJ SL X7R(B) Z5U
Y(X) U
Y5V
F
G
Y
V
Y5V
Y5V
Y
F
F
F
Y5V
-
NOMINAL CAPACITANCE CAPACITANCE TOLERANCE 6.3V 10 V 16 V 25 V 50 V 100 V 200V 250V 500V 630V 1000V 2000V 3000V 4000V NICKEL BARRIER TERMINATION Ag/Pd BULK(VINYL) PAPER TAPING PACKAGE PLASTIC TAPING BULK CASE E P 1, 3 7 E, U P B C 1 9 2, 4 (NONE) T, R Q P O A B C D E G H I J K N 6 Z Y 3 5 1 2 V 7 A G H J T V B:0.1 100 160 250 500 101 201 501 102 202 302
EX) 103=10,000 C:0.25 9 8 4 3 5 1 2 C D:0.5 06 10 16 25 50 100 200 250 500 630 1000 2000 3000 4000 A B B T, L H, N C
221=220 F:1% 6.3 10 16 25 50 100 200 250 500 630 1K 2K 3K (GRM) (GR) PB PT PT PC
225=2,200,000=2.2 G:2% 160 250 500 101 201 251 501 102 202 302 402 N P * T J:5%
1R5=1.5 K:10% 0J 1A 1C 1E 1H 2A 2D X E,V,W F, Y C
010=1 Z:-20~+80% J L E T U B T T 0J 1A 1C 1E 1H 2A 2E 2J 3A 3D 3F B T J X A B C E G H X F B C, P T, R G
M:20% 4 3 2 5 1 (MCH) (MC) K, L P, Q C
RATED VOLTAGE
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Multilayer Ceramic Capacitor - High Frequency
SAMSUNG : CL10B104KA8NNNC CL
Series 03 05 10 21 31 32 43 55
10
Size = = = = = = = = 0201 0402 0603 0805 1206 1210 1812 2220
B
Dielectric C P R S T U L B A F = = = = = = = = = = C0G P2H R2H S2H T2H U2H S2L X7R X5R Y5V
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance A = 0.05pF B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80,-20%
A
Voltage Q = 6.3V P = 10V O = 16V A = 25V B = 50V C = 100V D = 200V E = 250V G = 500V H = 630V I = 1000V
8
Thickness 3 = 0.30 5 = 0.50 8 = 0.80 A = 0.65 C = 0.85 H = 1.60 I = 2.00 J = 2.50 L = 3.20
N
Electrode/ Termination/ Plating A = Pd/Ag/ Sn 100% N = Ni/Cu/ Sn 100% G = Cu/Cu/ Sn 100%
N
Products
N
Special
C
Packaging Bulk Cassette Paper 7" Paper 13" (10,000EA) E = Embossing 7" F = Embossing 13" L = Paper 13" (15,000EA) O = Paper 10" S = Embossing 10" B P C D = = = =
A = Array Various (2-element) B = Array (4-element) C = High - Q L = LICC N = Normal P = Automotive W = 3 terminal chip
AVX : 06033C104KAT2A 0603
Size 0201 0402 0603 0805 1206 1210 1812 2220 2225
3
Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V B = 50V C = 100V D = 200V E = 250V G = 500V I = 1000V
C
Dielectric A C D E G = = = = = C0G X7R X5R Z5U Y5V
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80, -20% P = GMV,+100,-0%
A
Failure Rate A = N/A
T
Termination T = Sn 100% 7 = Gold Plated 1 = Pd/Ag
2
Packaging 2 4 7 9 = = = = 7" Reel 13" Reel Cassette Bulk
A
Special A T S R = = = = Standard 0.66mm 0.56mm 0.46mm
JOHANSON : 250R14W104KV6T 250
Voltage 2 significant figures + number of zeros
R14
Size R07 = 0402 R14 R15 R18 S41 S43 S47 S48 S49 S54 = = = = = = = = = 0603 0805 1206 1210 1812 2220 2225 1825 3640
W
Dielectric N = C0G W = X7R X = X5R Z = Z5U Y = Y5V
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20%
V
Termination V = Ni Barrier
6
Marking 4 = No Mark 6 = Marking
T
Packaging E = 7" Reel Plastic T = 7" Reel Paper R = 13" Reel Paper U = 13" Reel Plastic None = Bulk
Z = +80, -20% P = GMV,+100,-0%
KEMET : C0603C104K3RAC C
Series
0603
Size 0402 0603 0805 1206 1210 1812 2220 2225
C
Specification C = Standard A = GR900 P = Mil-C-55681 CDR01-CDR06 N = Mil-C-55681 CDR31-CDR35 Z = Mil-C-123 E = Mil Equivalent (Group A Only)
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80, -20% P = +100, 0%
3
Voltage 9 8 4 3 5 1 2 = = = = = = = 6.3V 10V 16V 25V 50V 100V 200V
R
Dielectric G R P U X V = = = = = = C0G X7R X5R Z5U BX(Mil) Y5V
A
Failure Rate A M P R S = = = = = Standard 1.0 (Mil) 0.1 (Mil) 0.01 (Mil) 0.001 (Mil)
C
Termination C H T G = = = = Ni w/Tin Plate Ni w/Solder Silver Gold Plated
- 26 -
Multilayer Ceramic Capacitor - High Frequency
KYOCERA : CM105X7R104K25AT CM
Series
105
Size 03 = 0201 05 = 0402 105 = 0603 21 = 0805 316 = 1206 32 = 1210 42 = 1808 43 = 1812 55 = 2220
X7R
Dielectric CG X8R X7R X5R Z5U Y5V Y5U
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80, -20% P = +100, 0%
25
Voltage 04 = 4V 06 = 6.3V 10 = 10V 16 = 16V 25 = 25V 50 = 50V 100 = 100V 250 = 250V 500 = 500V 1000 = 1000V
A
Termination A = Ni Barrier T L H N B C = = = = = =
T
Packaging 7" Reel (4mm Pitch) 13" Reel (4mm Pitch) 7" Reel (2mm Pitch) 13" Reel (2mm Pitch) Bulk (Vinyl Bags) Bulk Cassette
MURATA : GRM188R71E104KA01D GRM
Series Ni Barrier
18
Size 03 = 0201 15 18 21 31 32 42 43 55 = = = = = = = = 0402 0603 0805 1206 1210 1808 1812 2220
8
Thickness 3 = 0.3mm 5 = 0.5mm 8 = 0.8mm A = 1.0mm B = 1.25mm C = 1.6mm D = 2.0mm E = 2.5mm F = 3.2mm
R7
Dielectric 5C R7 R6 E4 F5 = = = = = C0G X7R X5R Z5U Y5V
1E
Voltage 0J = 6.3V 1A = 10V 1C = 16V 1E = 25V 1H = 50V 2A = 100V 2E = 250V 2H = 500V 3A = 1000V
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80,-20% P = +100, 0%
A01
Individual Specification Code
D
Packaging D = 7" Reel Paper L = 7" Reel Plastic J = 13" Reel Paper K = 13" Reel Plastic B = Bulk C = Bulk Cassette T = Bulk Tray
NOVACAP : 0603B104K250N_TM 1206
Size 0402 0603 0805 1005 1206 1210 1808 1812 2220 N B X Z Y = = = = =
B
Dielectric C0G X7R BX Z5U Y5V
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80,-20% P = +100, 0%
250
Voltage 2 significant figures + number of zeros
N
Termination P = Pd/Ag N = Ni Barrier (Sn 100%) Y = Ni Barrier (Sn/Pb)
Thickness Per Specified
T
Packaging T = Reel None = Bulk W = Waffle Pack
M
Marking
PANASONIC : ECJ1EB1E104K ECJ
Series Z 0 1 2 3 4
1
Size = = = = = = 0201 0402 0603 0805 1206 1210
E
Packaging X = Bulk E = Paper 2mm V = Paper 4mm F, Y = Plastic 4mm W = Large Reels 2mm Z = Large Reels 4mm C = Bulk Cassette
B
Dielectric C = C0G B = X7R, X5R F = Y5V
1E
Voltage 0J = 6.3V 1A = 10V 1C = 16V 1E = 25V 1H = 50V 2A = 100V 2D = 200V
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance C = 0.25pF D = 0.5pF F = 1% J = 5% K = 10% M = 20% Z = +80, -20%
- 27 -
Multilayer Ceramic Capacitor - High Frequency
ROHM : MCH182C104KKN MCH
Series 15 18 21 31 32 43
18
Size = = = = = = 0402 0603 0805 1206 1210 1812
2
Voltag e 4 3 2 5 = = = = 10V 16V 25V 50V
C
Dielectric A = C0G C = X7R F = Y5V
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80,-20% P = +100, 0%
K
Packaging K = 7" Reel Paper P = 7" Reel Plastic L = 13" Reel Paper Q = 13" Reel Plastic B = Bulk C = Bulk Cassette
N
Marking/Thickness N = Marked Special Thickness
TAIYO-YUDEN : TMK107BJ104K_T T
Voltage A = 4V J = 6.3V L = 10V E = 16V T = 25V U = 50V
M
Type M = Multilayer V = Hi Q
K
Termination K = Ni Barrier
107
Size 105 107 212 316 325 432 550 = = = = = = = 0402 0603 0805 1206 1210 1812 2220
BJ
Dielectric CG = C0G CH = C0H CJ = C0J CK = C0K BJ = X5R, X7R F = Y5V
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80,-20%
Special Various
T
Packaging T = Reel B = Bulk
TDK : C1608X7R1E104KT C
Series
1608
Size 0603 1005 1608 2012 3216 3225 4532 5650 = = = = = = = = 0201 0402 0603 0805 1206 1210 1812 2220
X7R
Dielectric CG X7R Z5U Y5V
1E
Voltage 0J = 6.3V 1A = 10V 1C = 16V 1E = 25V 1H = 50V
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80, -20%
T
Packaging T = Reel B = Bulk
VITRAMON : VJ0603Y104KXXMC VJ
Series
0603
Size 0402 0603 0805 1206 1210 1812 2225
Y
Dielectric X= A,N Y= U= H= BX = C0G X7R Z5U X8R
104
Capacitance 2 significant figures + number of zeros Use "R" for decimal point
K
Tolerance B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = +80, -20% P = +100, 0%
X
Termination X = Silver, Ni Barrier Tin Plated
X
Voltage J = 16V X = 25V A = 50V B = 100V C = 200V
M
Marking M = Marking A = No Marking C T P R B
C
Packaging = = = = = 7" Reel Paper 7" Reel Plastic 13" Reel Paper 13" Reel Plastic Bulk
- 28 -

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